钼铜合金芯片产品镀金镀镍应该怎么样选择厚度
钼铜合金 Mocu Alloys
钼铜合金是由两种互不固溶的金属钼和铜所组成的伪合金,兼具钼和铜的特性,具有高热传导率、低热膨胀系数、无磁性、低气体含量、良好的真空性能、良好的机加工性及特殊的高温性能等特性。MoCu alloy is a kind of pseudo-alloy that is composed of Molybdenum and copper. It consists of both the characteristics of molybdenum and copper, having high thermal conductivity, low thermal expansion coefficient, non-magnetic, low gas content, ideal vacuum performance, good machinability, special high temperature performance, etc .
相较于钨铜,钼铜合金密度较低,并且可以冲压加工,适合超大批量使用。
Compared with Wcu alloy, MoCu alloy has lower density and is easier to stamp It makes MoCu suitable for volume produce .
| 牌号Material | 钼含量 Mo Content | 铜含量 Copper Content | 密度 Density | 热导率 Thermal Conductivity at25℃ | 热膨胀系数 CTE at25℃ |
| Wt% | Wt% | g/cm3 | W/M·K | （10-6/K） | |
| Mo85Cu15 | 85±1 | Balance | 10 | 160-180 | 6.8 |
| Mo80Cu20 | 80±1 | Balance | 9.9 | 170-190 | 7.7 |
| Mo70Cu30 | 70±1 | Balance | 9.8 | 180-200 | 9.1 |
| Mo60Cu40 | 60±1 | Balance | 9.66 | 210-250 | 10.3 |
| Mo50Cu50 | 50±0.2 | Balance | 9.54 | 230-270 | 11.5 |
| Mo40Cu60 | 40±0.2 | Balance | 9.42 | 280-290 | 11.8 |
Mo85Cu15，Mo80Cu20，Mo70Cu30，Mo60Cu40，Mo50Cu50，Mo40Cu60，W90Cu10，W85Cu15，MoCu，钼铜合金片，钼铜电子封装热沉芯片
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